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    PRODUCT CENTER

    WP7607-1

    Hardware Specs

    Dimensions: 22 x 23 x 2.5 mm [LGA: 239 pins]

    Chipset: Qualcomm MDM9207

    Main Interfaces
    Link: USB OTG, 2 x UART, HSIC, SPI, I2C, SDIO
    Digital: GPIO’s, SIM
    Audio: I2S, PCM
    Analog: ADC, 1.8V out


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    Hardware Specs

    Dimensions: 22 x 23 x 2.5 mm [LGA: 239 pins]

    Chipset: Qualcomm MDM9207

    Main Interfaces
    Link: USB OTG, 2 x UART, HSIC, SPI, I2C, SDIO
    Digital: GPIO’s, SIM
    Audio: I2S, PCM
    Analog: ADC, 1.8V out


    Key Features

    • For EMEA
    • Dedicated Application core (Cortex A7 @ 1.3GHz) with 256MBytes Flash / 128MBytes RAM
    • Integrated open source Legato? embedded platform: Sandbox, connectivity, Middleware
    • Embedded SIM (Ready-to-Connect)
    • Embedded Yocto Linux distribution: LTS Kernel, free open source packages, BSP
    • VoLTE1, Voice (Digital PCM)
    • GNSS1: GPS / Glonass / Galileo / Beidou (QCOM Izat 7.0+ Gen 8C)
    • Open hardware mangOH? reference design support
    • Dual SIM single standby (DSSS) enhances roaming coverage
    • Firmware image switching for network flexibility

    Standard Features

    • Secure boot prevents unauthorized code on the target
    • Firmware image switching for network flexibility
    • Snap-in Socket for prototyping
    • Free, unlimited FOTA through AirVantage? FOTA Edition

    LTE Cat-1

    B1, B3, B7, B8, B20, B28

    HSPA+, UMTS

    B1, B8
    Contact us
    Online booking
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